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Toshiba Adds High Efficiency, 35A DrMOS

  IRVINE, Calif., Jan. 14 /PRNewswire/ -- Toshiba America Electronic Components, Inc. (TAEC)*, a committed leader that collaborates with technology companies to create breakthrough designs, announced today that the company has expanded its family of power multi-chip modules (MCM) with a single package, 35 Amp (A), 30 Volt (V) synchronous step-down converter switching module for high current, low voltage applications such as servers, desktop PCs, game machines and point-of-load modules for the server market.

Developed by Toshiba Corp. (Toshiba), the TB7004FL is designed to be compatible with Intel''s Driver-MOSFET 1.0 (DrMOS 1.0) specifications. The main components in this module are MOSFET gate drivers and high-side and low-side MOSFETs produced from Toshiba UMOS V-H process technology. The Toshiba UMOS V-H low-side MOSFET is optimized by minimizing the on-state resistance (RDSON), gate-to-drain capacitance (Cgd), Cgd/Cgs ratio, and gate resistance (Rg). The Toshiba UMOS V-H high-side MOSFET is enabled for fast switching, achieved through low gate switch charge (QSW) and gate resistance. The driver IC includes a high-speed MOS gate driver and level shifter functions to drive the high-side MOSFET. For more information on the UMOS V-H Series, please visit

A typical step-down converter on a PC or server motherboard may include two n-channel MOSFETs and one driver IC, per phase. "Replacing these components with the highly integrated TB7004FL MCM can save designers significant board space and improve efficiency by eliminating the stray inductance and capacitance between the driver and the power MOSFETs," said Jeff Lo, business development manager, power devices, for TAEC. "The additional components required to make a DC-DC converter, with the TB7004FL, are a PWM power management control IC, an external inductor and output capacitors."

The device features a wide input voltage range up to 19V, with a maximum rating of 30V, a high operating frequency up to 1 megahertz (MHz), and a small, thin QFN56 package that measures 8.0mm x 8.0mm x 0.85mm. Additional features of TB7004FL include built-in thermal shut-down function, built-in under voltage lockout function for the supply voltage to the internal driver IC, tri-state logic for the PWM terminal, and internal dead-time control for dead time optimization. At a switching frequency of 1MHz and output current of 30A, the TB7004FL achieves approximately 83 percent efficiency(1).

Technical Specifications Specification TB7004FL Input Voltage Rating 30V (max.) Control Circuit Supply Voltage 10V to 14V Output Current 35A Switching Frequency 1MHz (max.) PWM Signal Input 5V CMOS 3-State Function Built-in Low-side MOSFET Shutdown Function Not Built-in Boot Strap Switch Built-in Package Size 8mm x 8mm Number of Terminals 56

Pricing and Availability

The Toshiba 35A TB7004FL MCM is available now, with samples priced at $3.00 each.

Toshiba''s Discrete Products

Since 1986, Toshiba Corp. has ranked as the top discrete supplier on a worldwide basis, based on annual revenue from international shipments of total discrete products. According to the most recent annual report from market research firm Gartner Dataquest (San Jose, CA), Toshiba remained the top discrete semiconductor supplier. (Source: "2006 Worldwide Semiconductor Market Share Report," Gartner, released April 2007). More specifically, Toshiba is a leading supplier in a number of discrete product categories, including power transistors, rectifiers and thyristors, LMOS logic, CMOS logic, optoelectronics, small signal diodes and transistors. The company''s discrete devices are designed to meet the growing demand for high-performance and lower voltages in today''s wireless telecommunications and consumer electronics applications, while emphasizing its strengths in the automotive and industrial markets.

*About TAEC

Through proven commitment, lasting relationships and advanced, reliable electronic components, Toshiba enables its customers to create market-leading designs. Toshiba is the heartbeat within product breakthroughs from OEMs, ODMs, CMs, distributions and fabless chip companies worldwide. A committed electronic components leader, Toshiba designs and manufactures high-quality flash memory-based storage solutions, discrete devices, displays, advanced materials, medical tubes, custom SoCs/ASICs, digital multimedia and imaging products, microcontrollers and wireless components that make possible today''s leading cell phones, MP3 players, cameras, medical devices, automotive electronics and more.

Toshiba America Electronic Components, Inc. is an independent operating company owned by Toshiba America, Inc., a subsidiary of Toshiba Corporation, Japan''s largest semiconductor manufacturer and the world''s third largest semiconductor manufacturer (Gartner, 2007 WW Semiconductor Revenue Estimate, Dec. 2007). For additional company and product information, please visit

Information in this press release, including product pricing and specifications, content of services and contact information, is current and believed to be accurate on the date of the announcement, but is subject to change without prior notice. Technical and application information contained here is subject to the most recent applicable Toshiba product specifications. In developing designs, please ensure that Toshiba products are used within specified operating ranges as set forth in the most recent Toshiba product specifications and the information set forth in Toshiba''s "Handling Guide for Semiconductor Devices," or "Toshiba Semiconductor Reliability Handbook." This information is available at , or from your TAEC representative.

(1) Test conditions: VIN=12V, VOUT=1.3V

Source: Toshiba America Electronic Components, Inc.
  



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